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High-precision, fully automatic multi-chip die bonder Datacon 2200 Evo

Description

Operating time (uptime/downtime) approx. 5,213/84,684, year of manufacture 2006, S/N 95022181648, dimensions approx. 800 x 1,250 x 1,100 mm; 3 x 400 V, 50/60 Hz, 3.3 A, 2.3 kVA, vacuum - 0.8 bar/1.5...

[Ausschreibung] Betriebszeit (Uptime/Downtime) ca. 5.213/84.684, Baujahr 2006, S/N 95022181648, Maße ca. 800 x 1.250 x 1.100 mm; 3 x 400 V, 50/60 Hz, 3,3 A, 2,3 kVA, Vakuum - 0,8 bar/1,5...

Machine translation. The seller's German text is authoritative.

Sale conditions

Buyer's premiumSee the auction house
VATVAT 19% added
DeliveryCollection only
Sale modeTender (sealed bid)
Location76344 Eggenstein-Leopoldshafen
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About the sale

VEBEG GmbH
VEBEG GmbH · 46 lots
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Federal government Eggenstein-Leopoldshafen

High-precision, fully automatic multi-chip die bonder Datacon 2200 Evo

Original titleHochpräziser, vollautomatischer Multi-Chip Die Bonder Datacon 2200 Evo

Sealed bid
Tender
Ends on Wed 28 Oct, 13:00
Wed 28 Oct, 13:00 (Berlin time)
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VEBEG GmbH
Federal government · Frankfurt am Main
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